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电路设计->基础电路图->其他基础电路图->电路板术语大全 F-S

电路板术语大全 F-S

作者:沉默的offer时间:2018-08-09

Fluorescence荧光.
Flurocarbon Resin碳氟树脂.
Flush Conductor嵌入式线路 , 贴平式 导体.
Flush Point闪火点.
Flute退屑槽.
Flux助焊剂.
Foil Burr铜箔毛边.
Foil Lamination铜箔压板法.
Foot残足(干膜残余物).
Foot Print (LAnd Pattern)脚垫.
Foreign Material 外来物,异物.
Form-to-List布线说明清单.
Four Point Twisting四点扭曲法.
Free Radical自由基.
Freeboard干舷.
Frequency频率.
Frit 玻璃熔料.
Fully-Additive Process全加成法.
Fungus Resistance抗霉性.
Fused Coating熔锡层.
Fusing熔合.
Fusing Fluid助熔液.
*****G*****
G-10由连续玻纤所织成的玻纤布与
环氧树脂粘结剂所复合成的材料.
Gage, Gauge量规.
Gallium Arsenide (GaAs)砷化镓.
Galvanic Corrosion贾凡尼式腐蚀(电解式腐蚀).
Galvanic Series贾凡尼次序(电动次序).
Galvanizing镀锌.
GAP第一面分离,长刃断开.
Gate Array闸列,闸极数组.
Gel Time胶化时间.
Gelation Particle胶凝点.
Gerber Data ,Gerber File格博档案(是美商Gerber公司专为PCB面线路
图形与孔位,所发展一系列完整的软件档案).
Ghost Image阴影.
Gilding镀金 (现为:Glod Plating).
Glass Fiber玻纤.
Glass Fiber Protrusion/Gouging, Groove玻纤突出/挖破.
Glass Transition Temperature, Tg玻璃态转化温度.
Glaze釉面,釉料.
Glob Top圆顶封装体.
Glouble Test球状测试法.
Glycol (Ethylene Glycol)乙二醇.
Golden Board测试用标准板.
Grain Size结晶粒度.
Grass Leak 大漏.
Grid标准格.
Ground Plane /Earth Plane接地层.
Ground Plane Clearance接地空环.
Guide Pin导针.
Gull /Wing Lead鸥翼引脚.
*****H*****
Halation环晕.
Half Angle半角.
Halide卤化物.
Haloing白圈,白边.
Halon海龙,是CFC氟碳化物的一种商品名.
Hard Anodizing硬阳极化.
Hard Chrome Plating镀硬铬.
Hard Soldering硬焊.
Hardener (Curing Agent)硬化剂(或Curing Agent).
Hardness硬度.
Haring-Blum Cell海固槽.
Harness电缆组合.
Hay Wire跳线.
Heat Cleaning烧洁.
Heat Dissipation散热.
Heat Distortion Point (Temp)热变形点(温度).
Heat Sealing热封.
Heat Sink Plane散热层.
Heat Transfer Paste导热膏.
Heatsink Tool散热工具.
Hertz(Hz)赫.
High Efficiency Particulate Air Filter (HEPA)高效空气尘粒过泸机.
Hipot Test 高压电测.
Hi-Rel高度靠度.
Hit 击(钻孔时钻针每一次刺下的动作).
Holding Time停置时间.
Hole Breakout孔位破出.
Hole Counter数孔机.
Hole Density孔数密度.
Hole Preparation通孔准备.
Hole Pull Strength孔壁强度.
Hole Void破洞.
Hook 切削刀缘外凸.
Hot Air Levelling喷锡.
Hot Bar Soldering热把焊接.
Hot Gas Soldering热风手焊.
HTE(High Temperature Elongation)高温延伸性.
Hull Cell哈氏槽.
Hybrid Integrated Circuit混成电路.
Hydraulic Bulge Test液压鼓起试验.
Hydrogen Embrittlement氢脆.
Hydrogen Overvoltage氢过(超)电压.
Hydrolysis水解.
Hydrophilic亲水性.
Hygroscopic吸湿性.
Hypersorption超吸咐.
*****I*****
I.C. Socket绩体电路器插座.
Icicle锡尖.
Illuminance照度.
Image Transfer影像转移.
Immersion Plating浸镀.
Impedance阻抗.
Impedance Match阻抗匹配.
Impregnate含浸.
In-Circuit Testing组装板电测.
Inclusion异物,夹杂物.
Indexing Hole基准孔.
Inductance(L)电感.
Infrared(IR)红外线.
Input/Output输入/输出.
Insert, Insertion插接.
Inspection Overlay套检底片.
Insulation Resistance绝缘电阻.
Integrated Circuit(IC)绩体电路器.
Inter Face接口.
Interconnection互连.
Intermetallic Compound (IMC)接口共化物.
Internal Stress内应力.
Interposer互边导电物.
Interstitial Via-Hole(IVH)局部层间导通孔.
Invar殷钢(63.8%Fe,36%Ni,0.2%C).
Ion Cleanliness离子清洁度.
Ion Exchange Resins离子交换树脂.
Ion Migration离子迁移.
Ionizable (Ionic) Contaimination离子性污染.
Ionization游离,电离.
Ionization Voltage (Corona Level)电离化电压(电缆内部狭缝空气中,引起其
电离所施加之最小电压).
IPC美国印刷电路板协会.
Isolation隔离性,隔绝性.
*****J*****
JEDEC(Joint Electronic Device 联合电子组件工程委员会.
Engineering Council)
J-LeadJ型接脚.
Job Shop专业工厂.
Joule焦耳.
Jumper Wire跳线.
Junction接(合)面,接头.
Just-In-Time(JIT)适时供应,及时出现.
*****K*****
Kapton聚亚醯胺软板.
Karat克拉 (1克拉(钻石)=0.2g 纯金则24k金为
100%的钝金.
Kauri-Butanol Value考立丁醇值(简称K.B.值).
Kerf.切形,裁剪.
Kevlar聚醯胺纤维.
Key电键
Key Board键盘.
Kiss Pressure吻压, 低压.
Knoop Hardness努普硬度.
Known Good Die(KGD)已知之良好芯片.
Kovar科伐合金(Fe53%,Ni29%,Co17%).
Kraft Paper牛皮纸.
*****L*****
Lamda Wave延伸平波.
Laminar Flow平流.
Laminar Structure片状结构.
Laminate Void板材空洞.
Laminate(s)基板.
Lamination Void压合空洞.
Laminator压膜机.
LAnd孔环焊垫,表面焊垫.
LAndless Hole无环通孔.
Laser Direct Imaging (LDI)雷射直接成像.
Laser Maching雷射加工法.
Laser Photogenerator(LPG), Laser Photoplotter雷射曝光机.
Laser Soldering雷射焊接法.
Lay Back 刃角磨损Lay Out布线,布局.
Lay Up 叠合.
Layer to Layer Spacing层间距离
Leaching焊散漂出,熔出.
Lead 引脚.
Lead Frame脚架.
Lead Pitch脚距.
Leakage Current漏电电流.
Legend文字标记.
Leveling整平.
Lifted LAnd孔环(焊垫)浮起.
LigAnd错离子附属体.
Light Emitting Diodes (led)发光二极管.
Light Integrator光能累积器.
Light Intensity光强度.
Limiting Current Density极限电流密度.
Liquid Crystal Display (LCD)液晶显示器.
Liquid Dielectrics液态介质.
Liquid Photoimagible Solder Mask, (LPSM)液态感光防焊绿漆.
Local Area Network区域性网络.
Logic 逻辑.
Logic Circuit 逻辑电路.
Loss Factor损失因素.
Loss Tangent (TanδDK)损失正切.
Lot Size批量.
Luminance发光强度.
Lyophilic亲水性胶体.
*****M*****
Macro-Throwing Power巨观分布力.
Major Defect主要(严重)缺点.
Major Weave Direction主要织向.
Margin刃带(钻头尖部).
Marking标记.
Mask阻剂.
Mass Finishing大量整面(拋光).
Mass Lamination大型压板.
Mass Transport质量输送.
Master Drawing主图.
Mat席(用于CEM-3(Composite Epoxy Material)的
复合材料.)
Matte Side毛面(电镀铜皮(ED Foil)之粗糙面).
Mealing泡点.
Mean Time To Failure (MTTF)故障前可用之平均时数.
Measling白点.
Mechanical Stretcher机械式张网机.
Mechanical Warp机械式缠绕.
Mechanism机理.
Membrane Switch薄膜开关.
Meniscograph Test弧面状沾锡试验.
Meniscus弯月面.
Mercury Vaper Lamp汞气灯.
Mesh Count纲目数.
Metal Halide Lamp 金属卤素灯.
Metallization金属 化.
Metallized Fabric金属化纲布.
Micelle微胞.
Micro Wire Board微封线板.
Micro-electronios微电子.
Microetching微蚀.
Microsectioning微切片法.
Microstrip 微条.
Microstrip Line微条线,微带线.
Microthrowing Power微分布力.
Microwave微波.
Migration迁移.
Migration Rate迁移率.
Mil英丝.
Minimum Annular Ring孔环下限.
Minimum Electrical Spacing电性间距下限.
Minor Weave Direction次要织向.
Misregistration 对不准度.
Mixed Componmt Mounting Technology混合零件之组装技术.
Modem调变及解调器.
Modification修改.
Module模块.
Modulus of Elasticity弹性系数.
Moisture And Insulation Resistance Test湿气与绝缘电阻试验.
Mold Release 脱模剂,离型剂.
Mole摩尔.
Monofilament单丝.
Mother Board主机板,母板.
Moulded Circuit模造立体电路机.
Mounting Hole安装孔.
Mounting Hole组装孔,机装孔.
Mouse Bite鼠齿(蚀刻后线路边缘出现不规则缺口).
Multi-Chip-Module(MCM)多芯片芯片模块.
Multiwiring Board (or Discrete Wiring Board)复线板.
*****N*****
N.C.数值控制.
Nail Head钉头.
Near IR近红外线.
Negative负片,钻尖的第一面外缘变窄.
Negative Etch-back反回蚀.
Negative Stencil负性感光膜.
Negative-Acting Resist负性作用之阻剂.
Network纲状元件.
Newton牛顿.
Newton Ring 牛顿环.
Newtonian Liquid牛顿流体.
Nick缺口.
N-Methyl Pyrrolidine (NMP)N-甲基四氢哔咯.
Noble Metal Paste贵金属印膏.
Node节点.
Nodule节瘤.
Nomencleature标示文字符号.
Nominal Cured Thickness标示厚度.
Non-Circular LAnd非圆形孔环焊垫.
Non-flammable非燃性.
Non-wetting不沾锡.
Normal Concentration (Strength)标准浓度,当量浓度.
Normal Distribution常态分布.
Novolac酯醛树脂.
Nucleation , Nucleating核化.
Numerical Control数值控制.
Nylon尼龙.
*****O*****
Occlusion吸藏.
Off-Contact架空.
Offset第一面大小不均.
OFHC(Oxyen Free High Conductivity)无氧高导电铜.
Ohm欧姆.
Oilcanning盖板弹动.
OLB(Outer Lead Bond)外引脚结合.
Oligomer寡聚物.
Omega Meter离子污染检测仪.
Omega Wave振荡波.
On-Contact Printing密贴式印刷.
Opaquer不透明剂,遮光剂.
Open Circuits断线.
Optical Comparater光学对比器(光学放大器.)
Optical Density光密度.
Optical Inspection光学检验.
Optical Instrument光学仪器.
Organic Solderability Preservatives (OSP)有机保焊剂.
Osmosis渗透.
Outgassing出气,吹气.
Outgrowth悬出,横出,侧出.
Output产出,输出.
Overflow溢流.
Overhang总悬空.
Overlap 钻尖点分离.
Overpotantial(Over voltage)过电位,过电压.
Oxidation氧化.
Oxygen Inhibitor氧化抑制剂.
Ozone Depletion臭氧层耗损.
*****P*****
Packaging封装,构装.
Pad焊垫,圆垫.
Pad Master圆垫底片.
Pads Only Board唯垫板.
Palladium钯.
Panel制程板.
Panel Plating全板镀铜.
Panel Process全板电镀法.
Paper Phenolic纸质酚醛树脂(板材).
Parting Agent脱膜剂.
Passivation钝化 ,钝化外理.
Passive Device (Component)被动组件(零件)
Paste膏,糊.
Pattern板面图形.
Pattern Plating线路电镀.
Pattern Process线路电镀法.
Peak Voltage峰值电压.
Peel Strength抗撕强度.
Periodic Reverse (PR) Current周期性反电流.
Peripheral周边附属设备.
Permeability透气性,导磁率.
Permittivity诱电率,透电率.
pH Value酸碱值.
Phase相.
Phase Diagram相图.
Phenolic酚醛树脂.
Photofugitive感光褪色.
Photographic film感光成像之底片.
Photoinitiator感光启始剂.
Photomask光罩.
Photoplotter, Plotter光学绘图机.
Photoresist光阻.
Photoresist Chemical Machinning (Milling)光阻式化学(铣刻)加工.
Phototool底片.
Pick And Place拾取与放置.
Piezoelectric压电性.
Pin 插脚,插梢,插针.
Pin Grid Array (PGA)矩阵式针脚对装.
Pinhole针孔.
Pink Ring粉红圈.
Pitch跨距,脚距,垫距,线距.
Pits凹点.
Plain Weave平织.
Plasma电浆.
Plasticizers可塑剂,增塑剂.Plated Through Hole镀通孔.
Platen热盘.
Plating镀.
Plotting标绘.
Plowing犁沟.
Plug插脚,塞柱.
Ply层,股.
Pneumatic Stretcher气动拉伸器.
Pogo Pin伸缩探针.
Point 钻尖.
Point Angle钻尖面.
Point Source Light点状光源.
Poise泊.粘滞度单位=1dyne*sec/cm2.
Polar Solvent极性溶剂.
Polarity电极性.
Polarization分极,极化.
Polarizing Slot偏槽.
Polyester Films聚酯类薄片.
Polymer Thick Film (PTF)厚膜糊.
Polymerization聚合.
Polymide(PI)聚亚醯胺.
Popcorn Effect爆米花效应.
Porcelain瓷材,瓷面.
Porosity Test疏孔度试验.
Positive Acting Resist正性光阻剂.
Post Cure后续硬化,后烤.
Post Separation后期分离,事后公离.
Pot Life运用期,锅中寿命.
Potting铸封,模封.
Power Supply电源供应器.
Preform 预制品.
Preheat预热.
Prepreg胶片,树脂片.
Press Plate钢板.
Press-Fit Contact挤入式接触.
Pressure Foot 压力脚.
Pre-tinning预先沾锡.
Primary Image线路成像.
Print Through压透,过度挤压..
Probe探针.
Process Camera制程用照像机.
Process Window操作范围.
Production Master生产底片.
Profile轮廓,部面图,升温曲线图棱线.
Propagation传播.
Propagation Delay传播延迟.
Puddle Effect水坑效应.
Pull Away拉离.
Pulse Plating脉冲电镀法.
Pumice Powder 浮石粉.
Punch冲切.
Purge, Purging净空,净洗.
Purple Plague紫疫(金与铝的共化物层).
Pyrolysis热裂解,高温分解.
*****Q*****
Quad Flat Pack (QFP)方扁形封装体.
Qualification Agency资格认证机构.
Qualification Inspection资格检验.
Qualified Products List合格产品(供应者)名单.
Qualitative Analysis定性分析.
Quality Conformance Test Circuitry (Coupon)品质符合之试验线路(样板).
Quantitative Analysis定量分析.
Quench 淬火,骤冷.
Quick Disconnect快速接头.
Quill纬纱绕轴.
*****R*****
Rack 挂架.
Radial Lead放射状引脚.
Radio Frequency Interference (RFI)射频干扰.
Rake Angle抠角,耙角.
Rated Temperature, Voltage额定温度,额定电压.
Reactance电抗.
Real Estate底材面,基板面.
Real Time System 实时系统.
Reclaiming再生,再制.
Rediometer辐射计,光度计.
Reel to Reel卷轮(盘)式操作.
Reference Dimension参考尺度.
Reference Edge参考边缘.
Reflection反射.
Reflow Soldering重熔焊接,熔焊.
Refraction折射.
Refractive Index折射率.


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