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电路设计->安防电路图->报警器、警示器应用电路图->TI AM3352智能家庭和能源网关参考设计

TI AM3352智能家庭和能源网关参考设计

作者:angelazhang时间:2015-08-06

TI公司的AM335x系列产品是基于ARM Cortex-A8核的MCU,具有增强的图像,图形处理,外设和工业接口如EtherCAT和PROFIBUS,支持高级操作系统如Linux®和Android™,工作频率高达1GHz,主要用在游戏接口,销售机,家庭和工业自动化,称重仪,医疗电子,智能玩具,打印机和教学控制台.本文介绍了AM335x系列主要特性,功能框图,以及智能家庭和能源网关参考设计主要特性,框图,电路图和材料清单.

The AM335x microprocessors, based on the ARM Cortex-A8 processor, are enhanced with image, graphics processing, peripherals and industrial interface options such as EtherCAT and PROFIBUS. The devices support high-level operating systems (HLOS). Linux® and Android™ are available free of charge from TI.

The AM335x microprocessor contain the subsystems shown in Figure 1-1 and a brief description of each follows:

The microprocessor unit (MPU) subsystem is based on the ARM Cortex-A8 processor and the PowerVR SGX™ Graphics Accelerator subsystem provides 3D graphics acceleration to support display and gaming effects.

The Programmable Real-Time Unit Subsystem and Industrial Communication Subsystem (PRU-ICSS) is separate from the ARM core, allowing independent operation and clocking for greater efficiency and flexibility. The PRU-ICSS enables additional peripheral interfaces and real-time protocols such as EtherCAT, PROFINET, EtherNet/IP, PROFIBUS, Ethernet Powerlink, Sercos, and others. Additionally, the programmable nature of the PRU-ICSS, along with its access to pins, events and all system-on-chip (SoC) resources, provides flexibility in implementing fast, real-time responses, specialized data handling operations, custom peripheral interfaces, and in offloading tasks from the other processor cores of SoC.

AM335x系列主要特性:

Up to 1-GHz Sitara™ ARM® Cortex®-A8 32-Bit RISC Processor 
NEON™ SIMD Coprocessor
32KB of L1 Instruction and 32KB of Data Cache With Single-Error Detection (Parity)
256KB of L2 Cache With Error Correcting Code (ECC)
176KB of On-Chip Boot ROM
64KB of Dedicated RAM
Emulation and Debug – JTAG
Interrupt Controller (up to 128 Interrupt Requests)
On-Chip Memory (Shared L3 RAM) 
64KB of General-Purpose On-Chip Memory Controller (OCMC) RAM
Accessible to All Masters
Supports Retention for Fast Wakeup
External Memory Interfaces (EMIF) 
mDDR(LPDDR), DDR2, DDR3, DDR3L Controller: 
mDDR: 200-MHz Clock (400-MHz Data Rate)
DDR2: 266-MHz Clock (532-MHz Data Rate)
DDR3: 400-MHz Clock (800-MHz Data Rate)
DDR3L: 400-MHz Clock (800-MHz Data Rate)
16-Bit Data Bus
1GB of Total Addressable Space
Supports One x16 or Two x8 Memory Device Configurations
General-Purpose Memory Controller (GPMC) 
Flexible 8-Bit and 16-Bit Asynchronous Memory Interface With up to Seven Chip Selects (NAND, NOR, Muxed-NOR, SRAM)
Uses BCH Code to Support 4-, 8-, or 16-Bit ECC
Uses Hamming Code to Support 1-Bit ECC
Error Locator Module (ELM) 
Used in Conjunction With the GPMC to Locate Addresses of Data Errors from Syndrome Polynomials Generated Using a BCH Algorithm
Supports 4-, 8-, and 16-Bit per 512-Byte Block Error Location Based on BCH Algorithms
Programmable Real-Time Unit Subsystem and Industrial Communication Subsystem (PRU-ICSS)
Supports Protocols such as EtherCAT®, PROFIBUS, PROFINET, EtherNet/IP™, and More
Two Programmable Real-Time Units (PRUs) 
32-Bit Load/Store RISC Processor Capable of Running at 200 MHz
8KB of Instruction RAM With Single-Error Detection (Parity)
8KB of Data RAM With Single-Error Detection (Parity)
Single-Cycle 32-Bit Multiplier With 64-Bit Accumulator
Enhanced GPIO Module Provides Shift- In/Out Support and Parallel Latch on External Signal 
12KB of Shared RAM With Single-Error Detection (Parity)
Three 120-Byte Register Banks Accessible by Each PRU
Interrupt Controller Module (INTC) for Handling System Input Events
Local Interconnect Bus for Connecting Internal and External Masters to the Resources Inside the PRU-ICSS
Peripherals Inside the PRU-ICSS: 
One UART Port With Flow Control Pins, Supports up to 12 Mbps
One Enhanced Capture (eCAP) Module
Two MII Ethernet Ports that Support Industrial Ethernet, such as EtherCAT
One MDIO Port
Power, Reset, and Clock Management (PRCM) Module 
Controls the Entry and Exit of Stand-By and Deep-Sleep Modes
Responsible for Sleep Sequencing, Power Domain Switch-Off Sequencing, Wake-Up
Sequencing, and Power Domain Switch-On Sequencing
Clocks 
Integrated 15- to 35-MHz High-Frequency Oscillator Used to Generate a Reference 
Clock for Various System and Peripheral Clocks
Supports Individual Clock Enable and Disable Control for Subsystems and Peripherals to Facilitate Reduced Power Consumption
Five ADPLLs to Generate System Clocks (MPU Subsystem, DDR Interface, USB and Peripherals [MMC and SD, UART, SPI, I2C], L3, L4, Ethernet, GFX [SGX530], LCD Pixel Clock)
Power 
Two Nonswitchable Power Domains (Real- Time Clock [RTC], Wake-Up Logic [WAKEUP])
Three Switchable Power Domains (MPU Subsystem [MPU], SGX530 [GFX], Peripherals and Infrastructure [PER])
Implements SmartReflex Class 2B for Core Voltage Scaling Based On Die Temperature, Process Variation, and Performance (Adaptive Voltage Scaling [AVS])
Dynamic Voltage Frequency Scaling (DVFS)
Real-Time Clock (RTC) 
Real-Time Date (Day-Month-Year-Day of Week) and Time (Hours-Minutes-Seconds) Information
Internal 32.768-kHz Oscillator, RTC Logic and 1.1-V Internal LDO
Independent Power-on-Reset (RTC_PWRONRSTn) Input
Dedicated Input Pin (EXT_WAKEUP) for External Wake Events
Programmable Alarm Can be Used to Generate Internal Interrupts to the PRCM (for Wakeup) or Cortex-A8 (for Event Notification)
Programmable Alarm Can be Used With  External Output (PMIC_POWER_EN) to Enable 
the Power Management IC to Restore Non-RTC Power Domains
Peripherals 
Up to Two USB 2.0 High-Speed OTG Ports With Integrated PHY
Up to Two Industrial Gigabit Ethernet MACs (10, 100, 1000 Mbps) 
Integrated Switch
Each MAC Supports MII, RMII, RGMII, and MDIO Interfaces
Ethernet MACs and Switch Can Operate Independent of Other Functions
IEEE 1588v2 Precision Time Protocol (PTP)
Up to Two Controller-Area Network (CAN) Ports 
Supports CAN Version 2 Parts A and B
Up to Two Multichannel Audio Serial Ports (McASPs) 
Transmit and Receive Clocks up to 50 MHz
Up to Four Serial Data Pins per McASP Port With Independent TX and RX Clocks
Supports Time Division Multiplexing (TDM), Inter-IC Sound (I2S), and Similar Formats
Supports Digital Audio Interface Transmission (SPDIF, IEC60958-1, and AES-3 Formats)
FIFO Buffers for Transmit and Receive (256 Bytes)
Up to Six UARTs 
All UARTs Support IrDA and CIR Modes
All UARTs Support RTS and CTS Flow Control
UART1 Supports Full Modem Control
Up to Two Master and Slave McSPI Serial Interfaces 
Up to Two Chip Selects 
Up to 48 MHz
Up to Three MMC, SD, SDIO Ports 
1-, 4- and 8-Bit MMC, SD, SDIO Modes
MMCSD0 has Dedicated Power Rail for 1.8-V or 3.3-V Operation
Up to 48-MHz Data Transfer Rate
Supports Card Detect and Write Protect
Complies With MMC4.3, SD, SDIO 2.0 Specifications
Up to Three I2C Master and Slave Interfaces 
Standard Mode (up to 100 kHz)
Fast Mode (up to 400 kHz)
Up to Four Banks of General-Purpose I/O (GPIO) Pins 
32 GPIO Pins per Bank (Multiplexed With Other Functional Pins)
GPIO Pins Can be Used as Interrupt Inputs (up to Two Interrupt Inputs per Bank)
Up to Three External DMA Event Inputs that can Also be Used as Interrupt Inputs
Eight 32-Bit General-Purpose Timers 
DMTIMER1 is a 1-ms Timer Used for Operating System (OS) Ticks
DMTIMER4–DMTIMER7 are Pinned Out
One Watchdog Timer
SGX530 3D Graphics Engine 
Tile-Based Architecture Delivering up to 20 Million Polygons per Second
Universal Scalable Shader Engine (USSE) is a Multithreaded Engine Incorporating Pixel and Vertex Shader Functionality
Advanced Shader Feature Set in Excess of Microsoft VS3.0, PS3.0, and OGL2.0
Industry Standard API Support of Direct3D Mobile, OGL-ES 1.1 and 2.0, OpenVG 1.0, and OpenMax
Fine-Grained Task Switching, Load Balancing, and Power Management
Advanced Geometry DMA-Driven Operation for Minimum CPU Interaction
Programmable High-Quality Image Anti- Aliasing
Fully Virtualized Memory Addressing for OS Operation in a Unified Memory Architecture
LCD Controller 
Up to 24-Bit Data Output; 8 Bits per Pixel (RGB)
Resolution up to 2048 × 2048 (With Maximum 126-MHz Pixel Clock)
Integrated LCD Interface Display Driver (LIDD) Controller
Integrated Raster Controller
Integrated DMA Engine to Pull Data from the External Frame Buffer Without Burdening the Processor via Interrupts or a Firmware Timer
512-Word Deep Internal FIFO
Supported Display Types: 
Character Displays – Uses LIDD Controller to Program these Displays
Passive Matrix LCD Displays – Uses LCD Raster Display Controller to Provide Timing and Data for Constant Graphics Refresh to a Passive Display
Active Matrix LCD Displays - Uses External Frame Buffer Space and the Internal DMA Engine to Drive Streaming Data to the Panel
12-Bit Successive Approximation Register (SAR) ADC 
200K Samples per Second
Input can be Selected from any of the Eight Analog Inputs Multiplexed Through an 8:1 Analog Switch
Can be Configured to Operate as a 4-Wire, 5-Wire, or 8-Wire Resistive Touch Screen Controller (TSC) Interface
Up to Three 32-Bit eCAP Modules 
Configurable as Three Capture Inputs or Three Auxiliary PWM Outputs
Up to Three Enhanced High-Resolution PWM Modules (eHRPWMs) 
Dedicated 16-Bit Time-Base Counter With Time and Frequency Controls
Configurable as Six Single-Ended, Six Dual- Edge Symmetric, or Three Dual-Edge Asymmetric Outputs
Up to Three 32-Bit Enhanced Quadrature Encoder Pulse (eQEP) Modules
Device Identification 
Contains Electrical Fuse Farm (FuseFarm) of Which Some Bits are Factory Programmable 
Production ID
Device Part Number (Unique JTAG ID)
Device Revision (Readable by Host ARM)
Debug Interface Support 
JTAG and cJTAG for ARM (Cortex-A8 and PRCM), PRU-ICSS Debug
Supports Device Boundary Scan
Supports IEEE 1500
DMA 
On-Chip Enhanced DMA Controller (EDMA) has Three Third-Party Transfer Controllers (TPTCs) and One Third-Party Channel Controller (TPCC), Which Supports up to 64 Programmable Logical Channels and Eight QDMA Channels. EDMA is Used for: 
Transfers to and from On-Chip Memories
Transfers to and from External Storage (EMIF, GPMC, Slave Peripherals)
Inter-Processor Communication (IPC) 
Integrates Hardware-Based Mailbox for IPC and Spinlock for Process Synchronization Between Cortex-A8, PRCM, and PRU-ICSS 
Mailbox Registers that Generate Interrupts 
Four Initiators (Cortex-A8, PRCM, PRU0, PRU1)
Spinlock has 128 Software-Assigned Lock Registers
Security 
Crypto Hardware Accelerators (AES, SHA, PKA, RNG)
Boot Modes 
Boot Mode is Selected via Boot Configuration Pins Latched on the Rising Edge of the PWRONRSTn Reset Input Pin
Packages: 
298-Pin S-PBGA-N298 Via Channel Package (ZCE Suffix), 0.65-mm Ball Pitch
324-Pin S-PBGA-N324 Package (ZCZ Suffix), 0.80-mm Ball Pitch

AM335x系列应用:

• Gaming Peripherals 
• Connected Vending Machines
• Home and Industrial Automation 
• Weighing Scales
• Consumer Medical Appliances 
• Educational Consoles
• Printers 
• Advanced Toys
• Smart Toll Systems

图1。AM335x系列功能框图

智能家庭和能源网关参考设计案例

The Smart Home and Energy Gateway Reference Design provides example implementation for measurement, management and communication of energy systems for smart homes and buildings. This example design is a bridge between different communication interfaces, such as WiFi, Ethernet, ZigBee or Bluetooth, that are commonly found in residential and commercial buildings. Since objects in the house and buildings are becoming more and more connected, the gateway design needs to be flexible to accommodate different RF standard, since no single RF standard is dominating the market. This example gateway addresses this problem by supporting existing legacy RF standards (WiFi, Bluetooth) and newer RF standards (ZigBee, BLE).

智能家庭和能源网关参考设计主要特性:

Showcase co-existence of ZigBee, WiFi, Bluetooth and NFC (Near Field Communication) allows for simultaneous operation of the different communication profiles
Showcase seamless profile integration for smart energy, lighting and building automation
Showcase bridge between HAN (Home Area Network) and LAN (Local Area Network)/WAN (Wide Area Network)
Enables development of real world smart home and energy gateway applications, with the use of example schematics, bill of materials, design files, and links to free software package downloads


图2.智能家庭和能源网关参考设计板外形图


图3.智能家庭和能源网关参考设计框图

图4.智能家庭和能源网关参考设计电路图(1)

图5.智能家庭和能源网关参考设计电路图(2)

图6.智能家庭和能源网关参考设计电路图(3)

图7.智能家庭和能源网关参考设计电路图(4)

图8.智能家庭和能源网关参考设计电路图(5)

图9.智能家庭和能源网关参考设计电路图(6)

图10.智能家庭和能源网关参考设计电路图(7)

图11.智能家庭和能源网关参考设计电路图(8)

图12.智能家庭和能源网关参考设计电路图(9)

图13.智能家庭和能源网关参考设计电路图(10)

图14.智能家庭和能源网关参考设计电路图(11)

图15.智能家庭和能源网关参考设计电路图(12)

智能家庭和能源网关参考设计材料清单见:
智能家庭和能源网关参考设计材料清单.xls
am3352.pdf
tidr436.pdf


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